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400 g tub of viscous grey thermal paste with wooden spatula

CS Labs

CS Labs K5 PRO 400g Viscous Thermal Paste

SKU CH-FV98-5JG8H

High-conductivity viscous thermal paste replaces pads up to 3 mm thick, operates from -90 to 250 °C, and includes a spatula for easy application

  • WeightThermal Pads
  • High thermal conductivity for efficient heat transfer from memory chips and GPUs
  • Replaces soft thermal pads up to 3 mm gap without electrical conductivity risk
  • Easy direct application with included spatula for DIY and technician use
  • Stable performance from -90 °C to 250 °C with no expiration date
  • 400 g pack supplies roughly 400 to 800 applications for laptops, consoles and graphics cards

Viscous paste for thermal-pad replacement

CS Labs K5 PRO is a gummy thermal compound designed to replace soft thermal pads on memory chips and similar components. It suits technicians and DIY builders who need a putty-like material that stays in place on laptop GPUs, console boards or desktop graphics cards. The 400 g pack supplies enough paste for roughly 400 to 800 applications and includes a wooden spatula plus instructions. It is manufactured in Greece and carries no expiry date.

Thermals, noise and power draw in normal use

The paste delivers a thermal conductivity above 5,3 W/m.K, at least three times higher than typical pads used in consumer electronics. It remains non-electrically conductive across an operating range from -90 °C to 250 °C, so it adds no risk of shorting nearby circuitry. Because it replaces solid pads with a compliant layer, it eliminates air gaps without requiring clamping pressure that could stress delicate components. No moving parts are involved, so the material itself produces no noise or power draw.

Behaviour under sustained load

The compound maintains its viscosity and contact quality during prolonged high-temperature operation, resisting pump-out or drying that can degrade ordinary greases. Its infinite service life means the thermal interface stays consistent over years of continuous use in mining rigs, gaming laptops or consoles such as PS4, Nintendo Switch and Xbox. The wide temperature window ensures the paste does not harden or migrate even when components run near their thermal limits for extended periods.

Highlights

  • High thermal conductivity for efficient heat transfer from memory chips and GPUs
  • Replaces soft thermal pads up to 3 mm gap without electrical conductivity risk
  • Easy direct application with included spatula for DIY and technician use
  • Stable performance from -90 °C to 250 °C with no expiration date
  • 400 g pack supplies roughly 400 to 800 applications for laptops, consoles and graphics cards

Specifications

WeightThermal Pads

Questions about this item

How do I apply the 400 g K5 PRO paste and what step do people get wrong?

Squeeze the viscous compound directly onto the memory chip or GPU die using the included wood spatula, spread it evenly to fill gaps up to 3 mm, then reinstall the heatsink without over-tightening — the common error is re-using old thermal pads instead of replacing them with fresh paste.

What maintenance or replacement will the K5 PRO paste need later?

The paste has no expiration date and infinite storage life when kept sealed and frost-free; it only requires replacement if the heatsink is removed again for cleaning or upgrades.

What limit appears first during sustained loads with the K5 PRO paste?

Operational temperature range tops out at 250 °C, so prolonged heavy loads that push components toward that ceiling will hit the thermal limit before the paste degrades.

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