CS Labs K5 PRO 20g & K4 PRO 7g thermal paste set

Two-paste kit for BGA rework

This set combines K5 PRO gummy paste and K4 PRO low-viscosity paste for servicing graphics processors, memory chips and other BGA components in laptops, desktops and game consoles. The 20 g K5 PRO supply covers roughly 20 to 40 applications while the 7 g K4 PRO syringe handles direct die coverage.

Gummy and fluid compounds with wood spatula

K5 PRO replaces soft thermal pads up to 1 mm thick and can bridge gaps up to 3 mm with a sticky, non-conductive texture. K4 PRO flows easily onto bare dies and stays stable up to 220 °C. Both pastes ship in a branded zip bag with a wood spatula and an instruction flyer for clean, controlled application.

Non-conductive pastes rated from -90 to 250 °C

K5 PRO delivers thermal conductivity above 5,3 W/m·K and K4 PRO exceeds 4,6 W/m·K, each at least three times higher than common alternatives. Neither paste conducts electricity and both have no expiration date when stored sealed and protected from frost. Laboratory validation follows a comparative method published in 2014.