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White 1.5g syringe of thermal compound paste

BattleBorn

BattleBorn Thermal Compound Syringe 1.5g

SKU CH-Q889-RB008

A 1.5 g syringe of silicone-based thermal paste for CPU and GPU heat-sink applications

  • 5 g syringe simplifies precise application
  • Silicone-based formula fills microscopic gaps for efficient heat transfer
  • Non-conductive paste eliminates risk of electrical shorts
  • Thin-layer coverage maximises thermal conductivity between CPU or GPU and cooler
  • Durable compound extends component lifespan by maintaining consistent cooling performance

Thermal compound for CPU and GPU heatsinks

BattleBorn thermal grease is a silicone-based compound supplied in a 1.5g syringe. It is intended for PC builders and technicians who need to fill microscopic air gaps between a processor or graphics chip and its cooler. The paste contains no metallic particles so it does not conduct electricity. A minimal amount covers the mating surfaces for reliable heat transfer.

Limits of paste-only thermal interfaces

Thermal grease can only bridge the tiny voids left by surface imperfections; it cannot compensate for poor mounting pressure, warped heatspreaders or damaged cooler bases. Performance depends on applying a thin, even layer because excess paste acts as an insulator rather than a conductor. The compound is non-curing and non-metallic, so it avoids short-circuit risk but offers no structural adhesion.

1.5g syringe capacity for single

The 1.5 gram volume supplies enough material for several standard CPU or GPU installations when applied sparingly. Buyers planning to service many systems or who prefer a larger reservoir for repeated rework should consider a higher-capacity container. The syringe format allows controlled dispensing directly onto the die or heatspreader.

Highlights

  • 5 g syringe simplifies precise application
  • Silicone-based formula fills microscopic gaps for efficient heat transfer
  • Non-conductive paste eliminates risk of electrical shorts
  • Thin-layer coverage maximises thermal conductivity between CPU or GPU and cooler
  • Durable compound extends component lifespan by maintaining consistent cooling performance

Specifications

BrandBattleBorn

Questions about this item

How many applications can I get from the 1.5g syringe?

The 1.5g syringe provides enough compound for several CPU or GPU applications because only a thin layer is required to fill microscopic air gaps between the die and the cooler base.

What practical difference does the silicone-based formula make during installation?

Because it contains no metallic particles, the paste is electrically non-conductive, so accidental overflow onto the CPU socket or PCB traces will not cause a short circuit.

Does the syringe packaging affect how easily I can spread the compound?

The syringe design lets you dispense a controlled dot or line directly onto the heat spreader, making it simple to apply the minimal amount needed for optimal thermal transfer.

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