Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Arctic Silver
Ceramic-based compound lowers CPU temperatures by up to 10°C and remains stable from –150°C to 185°C
Arctic Silver CMQ2-25G is a ceramic-based thermal paste designed for CPU and GPU heat-spreader interfaces. The polysynthetic suspension fluid holds tri-linear ceramic particles without metal content, making it a pure electrical insulator. Builders who prefer non-conductive compounds for first-time applications or dense circuit areas will find the formula straightforward to spread and wipe clean.
Standard thermal compounds often leave microscopic air gaps that raise core temperatures under load. Ceramique 2 reduces full-load CPU temperatures by 2 to 10 degrees centigrade compared with those ordinary materials. The improvement is worthwhile whenever the existing interface has dried out, was applied unevenly, or uses a lower-grade filler that cannot sustain contact pressure over time.
The compound maintains its viscosity and particle distribution across a wide operating window, peaking at 185 °C without separating. A 25-gram syringe delivers approximately 9.2 cc, covering roughly 200 square inches at a 0.003-inch layer thickness. This consistency means repeated thermal cycles do not degrade the bond or pump out material from between the die and cooler base.
No published specifications for this item yet.
At a layer 0.003" thick, one 25-gram tube covers about 200 square inches, which is roughly 9.2 cc of compound.
Dispense a small amount directly onto the centre of the CPU heat spreader and let the cooler mounting pressure spread it evenly; do not manually spread the paste with a card or finger.
The compound is rated for long-term use up to 130°C; if your CPU regularly exceeds this temperature under load, plan to replace the paste sooner than the typical multi-year interval.
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