Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Arctic Silver
A 2.7 g syringe of ceramic thermal compound covers roughly 22 square inches at a .003 inch layer, stays stable up to 150 °C long-term and peaks above 185 °C.
Arctic Silver Ceramique2 is a ceramic-based thermal paste designed for modern high-power CPUs and performance heatsinks or water-cooling solutions. The compound contains no metal particles, so it is neither electrically conductive nor capacitive. A 2.7 gram syringe provides enough material for multiple applications.
The average particle size is 0.36 microns, with 70 particles lined up equalling one-thousandth of an inch. This tri-linear composite of aluminium oxide, zinc oxide and boron nitride enables the thinnest possible bond line between processor and cooler. One tube covers approximately 22 square inches at a 0.003 inch layer thickness.
Peak temperature tolerance reaches 150 °C to above 185 °C, while long-term stability is rated from 150 °C down to 130 °C. The high-density ceramic formula maintains consistent thermal transfer without drying out or degrading under continuous high-heat operation. No electrical conductivity eliminates short-circuit risk if paste spreads beyond the die.
| Brand | Arctic Silver |
|---|---|
| Model | AS-CMQ2-27 |
| Specifications | Average Particle Size: 0.36 microns <0.000015 inch (70 particles lined up in a row equal 1/1000th of an inch.) Temperature Limits: Peak: 150 C to >185 C Long-Term: 150 C to 130 C Coverage Area: 2.7gram syringe (Approximately 1cc). At a layer 0.003" thick, one tube will cover about 22 square inches. |
| Features | Arctic Silver is the premier manufacturer of extreme performance thermally conductive compounds. Ceramique2, released in May 2011, is a high density, ceramic based thermal compound specifically designed for modern high power CPUs and high performance heatsinks or water cooling solutions. Tri Linear Ceramic Content: Ceramique2 uses only ceramic fillers so it is neither electrically conductive nor capacitive. The tri linear composite of aluminium oxide, zinc oxide and boron nitride allows the thinnest possible bond line with modern processors, heatsinks and electronics. Critically size |
The ultra-fine particles let the compound form an extremely thin bond line, filling microscopic gaps between the processor lid and cooler base for more efficient heat transfer.
There is no industry standard for thermal paste; the practical limit is the 150 °C long-term and 185 °C peak temperature rating beyond which the compound may degrade.
The syringe dispenses directly onto the CPU heat spreader; one tube covers roughly 22 square inches at a 0.003-inch layer, enough for multiple desktop processor applications.
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