Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Arctic Silver
High-density silver and ceramic filler lowers CPU core temperatures by 3 to 12 degrees Celsius, and the 3.5 g syringe covers 15 to 25 small cores or 6 to 10 large cores
Arctic Silver 5 is a high-density thermal compound containing 99.9% pure micronized silver and enhanced ceramic particles. It is formulated for enthusiasts and system builders who need reliable heat transfer between modern high-power CPUs and performance heatsinks or water-cooling solutions. The non-electrically conductive formula eliminates the risk of short circuits during application. Over 88% thermally conductive filler by weight ensures consistent performance.
The compound is optimised for a wide range of bond lines found in current CPU installations. It will not separate, run, migrate or bleed after application, maintaining stability through thermal cycles. Thermal conductance exceeds 350 000W/m2 degreesC at a 0.001 inch layer thickness. The material is easy to apply and remove, simplifying maintenance or upgrades without damaging components.
A 3.5 gram syringe provides enough compound for at least 15 to 25 small CPU cores or 6 to 10 large CPU cores. It also covers 2 to 5 heat plates depending on size. At a 0.003 inch layer, the syringe covers approximately 16 square units of surface area. Users requiring coverage for larger arrays of processors or extensive cold-plate surfaces will need additional syringes.
| Brand | Arctic Silver |
|---|---|
| Series | AS5-3.5G |
| Model | AS5-3.5G |
A 3.5 g syringe covers 15 to 25 small CPU cores, 6 to 10 large CPU cores, or 2 to 5 heat plates at a 0.003 inch layer thickness.
Testing shows 3 to 12 degrees Celsius lower CPU full-load core temperatures compared with standard thermal compounds or pads.
It is non-electrically conductive and rated at over 350 000 W/m²°C for a 0.001 inch layer.
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