Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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ARCTIC COOLING
Silicone thermal pads measuring 120 by 20 by .5 millimetres, supplied in a pack of four for filling gaps between components and heatsinks
This pack contains four silicone-based thermal pads measuring 120 by 20 millimetres with a thickness of 0.5 millimetres. They are designed to transfer heat from components such as memory modules or voltage regulators to a heatsink. The material is electrically isolating and contains no metallic particles, so accidental contact with circuit traces will not cause a short. Builders who need a simple, non-conductive gap filler for tight spaces will find these pads a practical choice.
Each pad features a non-stick coating that lets you lift and reposition it during installation without tearing or leaving residue. This makes the process forgiving for first-time builders and reduces waste if alignment needs adjustment. The pads are supplied pre-cut to the stated dimensions, so no trimming is required for typical memory or VRM layouts. Users who prefer a liquid compound that spreads under pressure will not get that behaviour from these solid pads.
The low-hardness silicone compresses easily, conforming to uneven surfaces and bridging small gaps between component and cooler without excessive pressure. This helps maintain consistent contact across slightly warped or stepped surfaces. The 0.5 millimetre thickness suits many factory gap tolerances, but builders with larger clearances will need a thicker option. The pads are chemically stable and do not dry out or pump out over time like some greases can.
| Brand | Arctic |
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Silicone pads like these do not dry out or pump out, so they last until the cooler is removed or the surfaces change; reinstallation is easy because the material is non-stick.
The 0.5 mm thickness and silicone-based filler set the thermal resistance; sustained loads are limited by that fixed conductivity rather than by degradation.
The pad is passive — it generates no heat and consumes no power; it simply conducts heat between the component and the heatsink without electrical risk.
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