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White 30g syringe of grey thermal paste with black cap

ARCTIC COOLING

ARCTIC COOLING MX-2 30g ACTCP00003B thermal paste

SKU CH-C6W0-2AXH1 MPN ACTCP00003B

30 g carbon-particle thermal compound rated at 5.6 W/mK, non-conductive and safe for CPU or GPU use

  • Volume / Net Weight30g
  • Thermal Conductivity5.6 W/mK
  • SpecificationsThermal Conductivity: 5.6 W/(mK) Viscosity: 850 poise Densit
  • FeaturesAMAZON #1 BESTSELLER: The MX-2 convinces everyone with its u
  • High thermal conductivity of 5.6 W/mK for efficient heat transfer
  • Carbon micro-particles ensure excellent temperature reduction on CPU and GPU
  • Metal-free non-conductive formula eliminates short-circuit risk during application
  • 30 g syringe provides enough compound for multiple installations
  • High durability paste maintains performance without drying or cracking

Product Identity

The ARCTIC MX-2 thermal compound comes in a 30g syringe for CPU and GPU applications. Its carbon micro-particle formula delivers 5.6 W/mK thermal conductivity. The paste is metal-free and non-electrically conductive, removing short-circuit risk during installation. It suits builders who want reliable heat transfer without liquid-metal hazards.

Thermals, Noise and Power Draw

The 5.6 W/mK conductivity rating measures steady-state heat flow between die and cooler. The 850 poise viscosity keeps the compound in place without pumping out over time. Volume resistivity of 1.22 x 1012 O-cm confirms electrical isolation under normal voltage. Density of 3.96 g/cm³ gives a consistent spread that resists drying.

Sustained Load Behaviour

Carbon particles do not degrade or separate under prolonged thermal cycling like some metal or silicon pastes. The non-curing compound maintains its viscosity and contact integrity through repeated heat-soak periods. Long-term stability means re-application intervals can be extended. Users needing higher conductivity for extreme overclocking should consider alternative formulations.

Highlights

  • High thermal conductivity of 5.6 W/mK for efficient heat transfer
  • Carbon micro-particles ensure excellent temperature reduction on CPU and GPU
  • Metal-free non-conductive formula eliminates short-circuit risk during application
  • 30 g syringe provides enough compound for multiple installations
  • High durability paste maintains performance without drying or cracking

Specifications

BrandARCTIC COOLING
SeriesMX-2 30g
ModelACTCP00003B
Volume / Net Weight30g
Thermal Conductivity5.6 W/mK
SpecificationsThermal Conductivity: 5.6 W/(mK)
Viscosity: 850 poise
Density: 3.96 g/cm³
Volume Resistivity: 1.22 x 1012 O-cm
FeaturesAMAZON #1 BESTSELLER: The MX-2 convinces everyone with its usual quality and performance, that have always distinguished it
EXCELLENT PERFORMANCE: Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently
HIGH PERFORMANCE: With excellent temperature reduction performance, the MX-2 is ideal for CPU and GPU cooling, and other applications between power semiconductor components and heatsinks
SAFE APPLICATION: The MX-2 is metal-free and non-electrical conductive which eliminates
Shipping weight0.05 kg
Package size150 × 33 × 20 mm

Questions about this item

How do I apply the MX-2 thermal paste correctly and what common step should I avoid?

Apply a small pea-sized dot or thin line onto the centre of the CPU heat spreader, then mount the cooler straight down; do not spread the paste manually with a card or finger because that traps air bubbles and reduces the 5.6 W/mK conductivity.

Will the MX-2 compound need replacement or maintenance after installation?

The carbon micro-particle formula is non-drying and rated for high durability, so it does not require periodic re-application unlike metal or silicon-based compounds that can pump out or degrade over time.

What thermal limit appears first when the MX-2 is under sustained heavy load?

With 5.6 W/mK conductivity, 850 poise viscosity and 3.96 g/cm³ density, the paste itself remains stable; the practical limit is the cooler's ability to move heat away from the CPU or GPU die.

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