Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Alphacool
Ultra-soft thermal pad with embedded fabric delivers 3 W/mK conductivity in a 100 x 100 x 0.5 mm sheet for gap-free heat transfer without electrical conduction
The Alphacool Eisschicht Ultra Soft thermal pad uses thermal paste with embedded fabric to fill gaps between heatsinks and components. It measures 100 x 100 x 0.5 mm and provides a thermal conductivity of 3 W/mk. The material is not electrically conductive, making it safe for direct contact with circuitry. It suits PC builders and tinkerers who need a reliable gap-filler for maintenance or upgrades.
The fabric-reinforced paste structure maintains consistent contact pressure during extended thermal cycling without hardening or pumping out. Its soft consistency prevents excessive stress on solder joints and delicate components while displacing air effectively. The pad continues to bridge microscopic surface imperfections even after prolonged heating and cooling periods. Performance remains stable because the composite design resists the dry-out typical of conventional pads.
The 100 x 100 mm sheet can be cut to size with scissors for precise fitting on memory modules, VRM heatsinks or GPU backplates. The ultra-soft texture conforms instantly without requiring heavy mounting pressure. Take care not to tear the fabric layer when handling thin sections. Ensure both surfaces are clean and free of old compound residue before application for optimal thermal transfer.
| Brand | Alphacool |
|---|---|
| Model | 1018056 |
| Part Number | 1018056 |
| Features | As a basic component or spare part include thermal pads in any well organized computer tinker! |
The pad is a passive material with no moving parts, so it adds no noise or heat of its own.
You need a clean mounting surface on the cooler and the chip, plus a screwdriver or clips to hold the cooler in place.
Its soft, fabric-reinforced paste layer conforms to gaps and height differences without stressing solder joints.
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