Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Alphacool
High-end thermal pad with 11 W/mK conductivity, sized 100 x 100 x 1 mm, stays soft without drying out
The Alphacool Apex Soft thermal pad is a high-end DIY cooling component designed for enthusiasts who need reliable heat transfer on small components. Its soft consistency allows it to nestle closely against voltage converters, VRMs or memory modules without applying excessive pressure that could bend a PCB. The material behaves similarly to thermal paste while remaining a solid pad.
Rated at 11W/mK thermal conductivity, the pad fills microscopic gaps effectively to move heat from the component to the heatsink. Unlike conventional silicone pads, the Apex Soft material does not dry out or harden over time, so its performance remains consistent across extended use. This prevents the rapid degradation typical of standard pads.
The pad measures 100x100x1mm and is supplied with a protective foil that stays on during cutting. You can trim it to shape with ordinary scissors as easily as paper, and the cut edges stay clean without fraying. The grey colour makes the material easy to see against dark circuit boards during installation.
| Brand | Alphacool |
|---|---|
| Model | 4250197130196 |
| Features | The Apex Soft are Alphacool's high-end solution in the range of thermal pads. Due to their outstanding properties, they can almost be compared to a thermal paste. The Apex Soft thermal pads nestle much better to components, which contributes to a significant improvement in cooling performance. |
Keep the protective foil on while cutting the pad to size with scissors, then peel the foil off and press the soft material onto the component; it conforms like paste without needing high mounting pressure.
No — the Apex Soft compound does not bleed silicone, so it stays pliable and keeps its thermal performance for a much longer period than conventional pads.
The 1mm thickness sets the thermal resistance floor; once the interface is saturated, the pad itself becomes the bottleneck before the cooler can move more heat away.
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