MSD Ignition 84747 Ford Crate Engine Ignition Kit 351C-460
- Ford Crate Engine D…
- 8.80"
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10 g silicone thermal adhesive rated at 1.5 W/m·k for permanent bonding of heatsinks to VRM, VRAM, MOSFET and LED components
This 10 g silicone thermal glue creates a permanent, non-conductive bond between heatsinks and components such as GPU VRM, VRAM, MOSFETs and high-power LEDs. Its 1.5 W/m-k thermal conductivity transfers heat away from small IC chips and 3D-printer Peltier modules. The adhesive cures into a structural joint that does not require mechanical clamping.
At 1.5 W/m-k the material suits low-to-medium heat loads but cannot match the 3.17 W/m-k or 6.5 W/m-k pastes used on desktop CPUs or overclocked GPUs. The permanent bond also prevents rework, so the glue is unsuitable when a heatsink must be removed for service or upgrade. Electrical non-conductivity protects delicate PCB traces during application.
Verify that the parts to be bonded fit together with minimal gap, because the glue does not flow like a paste and cannot fill large voids. Confirm that the assembly will never need disassembly, since the bond is irreversible. Ensure the operating temperature range of the target device stays within the silicone adhesive’s rated limits.
| Brand | Easycargo |
|---|
The 10 g tube suits small jobs such as bonding a few VRM or VRAM heatsinks; the 20 g, 100 g and 200 g options are pastes that do not glue, so pick them only if you need reusable thermal compound.
It indicates modest heat transfer — enough for MOSFETs, voltage regulators and LED arrays, but lower than the 3.17 W/m-k or 6.5 W/m-k pastes used on high-end CPUs.
The adhesive is non-conductive, so it will not short delicate PCB traces or IC pins when applied to VRM, VRAM or MOSFET components.
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