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Traditions (Generic)

Traditions (Generic) 10g Thermal Glue 1.5 W/m-k

SKU CH-XC9J-ZNX2H

10 g silicone thermal adhesive rated at 1.5 W/m·k for permanent bonding of heatsinks to VRM, VRAM, MOSFET and LED components

  • Rapid heat dissipation with 1.5 W/m-k conductivity
  • Safe non-conductive formula protects delicate PCB components
  • Permanent silicone bond secures heatsinks to VRM and VRAM
  • Versatile adhesive for MOSFETs, LEDs and Peltier modules
  • 10 g syringe provides enough glue for multiple repairs

Thermal glue for permanent heatsink bonding

This 10 g silicone thermal glue creates a permanent, non-conductive bond between heatsinks and components such as GPU VRM, VRAM, MOSFETs and high-power LEDs. Its 1.5 W/m-k thermal conductivity transfers heat away from small IC chips and 3D-printer Peltier modules. The adhesive cures into a structural joint that does not require mechanical clamping.

Conductivity limits for high-power devices

At 1.5 W/m-k the material suits low-to-medium heat loads but cannot match the 3.17 W/m-k or 6.5 W/m-k pastes used on desktop CPUs or overclocked GPUs. The permanent bond also prevents rework, so the glue is unsuitable when a heatsink must be removed for service or upgrade. Electrical non-conductivity protects delicate PCB traces during application.

Check component clearance and service needs

Verify that the parts to be bonded fit together with minimal gap, because the glue does not flow like a paste and cannot fill large voids. Confirm that the assembly will never need disassembly, since the bond is irreversible. Ensure the operating temperature range of the target device stays within the silicone adhesive’s rated limits.

Highlights

  • Rapid heat dissipation with 1.5 W/m-k conductivity
  • Safe non-conductive formula protects delicate PCB components
  • Permanent silicone bond secures heatsinks to VRM and VRAM
  • Versatile adhesive for MOSFETs, LEDs and Peltier modules
  • 10 g syringe provides enough glue for multiple repairs

Specifications

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Questions about this item

Should I choose the 10 g tube or a larger 20 g, 100 g or 200 g size?

The 10 g tube suits small jobs such as bonding a few VRM or VRAM heatsinks; the 20 g, 100 g and 200 g options are pastes that do not glue, so pick them only if you need reusable thermal compound.

What does the 1.5 W/m-k rating mean once the glue is on a GPU VRM or LED heatsink?

It indicates modest heat transfer — enough for MOSFETs, voltage regulators and LED arrays, but lower than the 3.17 W/m-k or 6.5 W/m-k pastes used on high-end CPUs.

Is this glue electrically conductive, and will it short PCB traces?

The adhesive is non-conductive, so it will not short delicate PCB traces or IC pins when applied to VRM, VRAM or MOSFET components.

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