We take cryptocurrency — so the coins you hold can buy real hardware.Pay in crypto, spend it on real hardware. Free insured shipping worldwide over $399. Plain, unbranded boxes, sent from Germany.Free insured shipping over $399. Your rate is locked for 30 minutes once checkout opens.Rate locked 30 minutes. Every item sealed, serial-checked and covered by a 24-month warranty.Sealed, 24-month warranty.

Saved items Sign in
A thin rectangular thermal pad, light grey, 120 by 20 by 0.5 mm

Thermal Grizzly

Thermal Grizzly TG-MP8-120-20-05-1R chipset cooling 120 x 20 x 0.5 mm

SKU CH-Z065-JFR8W MPN TG-MP8-120-20-05-1R

High-performance thermal pad measuring 120 x 20 x 0.5 mm with 8.0 W/mK conductivity for chipset and memory cooling

  • TypeCPU Block
  • High thermal conductivity of 8.0 W/mK for efficient heat transfer
  • Compressible ceramic-silicone compound fills microscopic gaps under slight pressure
  • Electrically insulating material prevents short circuits on sensitive components
  • Operating range from -100 °C to +250 °C suits extreme environments
  • RoHS-compliant and environmentally friendly composition

Thermal Pad for Chipsets

The Thermal Grizzly Minus Pad 8 is a ceramic-silicone thermal interface sheet sized 120 x 20 x 0.5 mm. It targets builders and technicians who need reliable heat transfer between chipset heatsinks, voltage-regulator modules or memory chips and their coolers.

Suits high-conductivity needs, not thicker gaps

The 8.0 W/mK rating and high compressibility suit applications where a thin, electrically insulating pad must fill microscopic surface variations. Buyers needing a thicker pad to bridge larger gaps between component and heatsink should look at other thicknesses in the same series.

0.5 mm thickness decides fit

At exactly 0.5 mm this pad fits tight clearances where standard 1 mm sheets would lift the cooler or stress the board. Verify the exact gap in your assembly before ordering.

Highlights

  • High thermal conductivity of 8.0 W/mK for efficient heat transfer
  • Compressible ceramic-silicone compound fills microscopic gaps under slight pressure
  • Electrically insulating material prevents short circuits on sensitive components
  • Operating range from -100 °C to +250 °C suits extreme environments
  • RoHS-compliant and environmentally friendly composition

Specifications

TypeCPU Block

Questions about this item

What gap thickness does the 0.5 mm pad compress to fit?

The 0.5 mm pad compresses under slight pressure to fill gaps smaller than its nominal thickness while maintaining the 8.0 W/mK conductivity across the 120 × 20 mm surface.

How do I install the Minus Pad 8 on a chipset without tearing the 0.5 mm sheet?

Remove the protective film, align the 120 × 20 mm pad over the chip, and apply even pressure; the high compressibility lets it conform without excessive force that could damage the thin layer.

When should I replace the pad if the chipset runs near the 250 °C upper limit?

The ceramic-silicone compound is rated from -100 °C to +250 °C; replace the pad if it dries out, loses tackiness, or no longer compresses evenly after prolonged exposure to high temperatures.

New to this? Which coin should you pay with — what to check, what it costs to pay, and what is never asked for.

Also in this aisle

People compared these

Same shelf, same checkout — eight coins and a 30-minute rate lock.