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Square grey thermal pad, 100 by 100 by 1.5 mm

Thermal Grizzly

Thermal Grizzly TG-MP8-100-100-15-1R chipset cooling 100x100x1.5mm 8.0 W/mK

SKU CH-PZ6Z-2GY8J MPN TG-MP8-100-100-15-1R

High-performance 8.0 W/mK thermal pad measuring 100x100x1.5mm for chipset and memory cooling

  • High thermal conductivity of 8.0 W/mK for efficient heat transfer
  • Highly compressible material fills microscopic gaps under minimal pressure
  • Electrically insulating ceramic-silicone compound prevents short circuits
  • Wide operating range from -100 °C to +250 °C ensures stability
  • RoHS compliant and environmentally friendly composition

Ideal for chipset and VRM cooling

The Thermal Grizzly Minus Pad 8 is a high-performance thermal interface pad measuring 100 by 100 by 1.5 millimetres. It targets builders and technicians who need reliable heat transfer for memory modules, chipsets or voltage regulator zones. The ceramic-silicone compound with nano-aluminum oxide delivers a thermal conductivity of 8.0 W/mK. Its electrically insulating properties ensure safe application across exposed circuitry.

Handles extreme temperatures silently

With an operating range from minus 100 to plus 250 degrees Celsius, the pad remains stable under heavy workloads and rapid thermal cycling. The material requires only slight pressure to conform to microscopic surface gaps, eliminating air pockets without mechanical fasteners. Zero moving parts mean completely silent operation and no power draw. RoHS compliance confirms the absence of restricted hazardous substances.

Flexible sheet simplifies custom cuts

The 100 by 100 millimetre square sheet can be trimmed with scissors to fit irregular component layouts or multiple smaller dies. High compressibility allows the 1.5 millimetre thickness to adapt to varying stack heights across a single board. The tacky surface holds position during assembly without adhesive residue. Environmentally friendly composition supports disposal through standard electronics recycling channels.

Highlights

  • High thermal conductivity of 8.0 W/mK for efficient heat transfer
  • Highly compressible material fills microscopic gaps under minimal pressure
  • Electrically insulating ceramic-silicone compound prevents short circuits
  • Wide operating range from -100 °C to +250 °C ensures stability
  • RoHS compliant and environmentally friendly composition

Specifications

No published specifications for this item yet.

Questions about this item

How do I install the 100x100x1.5mm pad and what step do people get wrong?

Cut the pad to size, peel both protective films, place it on the chipset or memory module, then apply even pressure — the common mistake is leaving one film on, which blocks the 8.0 W/mK conductivity.

What maintenance or replacement will the minus pad 8 need later?

The ceramic-silicone compound does not dry out or pump out; plan to replace it only when you disassemble the block or if the pad is physically torn during a future upgrade.

What limit shows up first under sustained use?

The pad stays stable up to +250 °C, so the practical limit is the component's own thermal throttle point — the pad itself will not degrade first.

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