Lay Filaments
Lay Filaments HIGH-T-Lay Dissolvable Support Filament 2.85 mm 0.75 kg 3D Printers Accessories
Water-soluble support filament withstands 100 °C, prints at 235–250 °C, and dissolves without chemicals for complex ABS, POM, or polycarbonate parts
- Dissolves quickly in plain water without harsh chemicals
- Withstands 100 °C for extended periods during printing
- Adheres strongly to ABS, POM and polycarbonate
- Extrudes at 235–250 °C with ±0.1 mm tolerance
- 75 kg spool of 2.85 mm water-soluble filament
High-temperature dissolvable support
High-T-Lay is a water-soluble support filament designed for printers that run at elevated temperatures. It withstands 100 °C for long periods and prints at 235 to 250 °C with a 50 °C bed. The 2.85 mm diameter suits compatible Bowden and direct-drive systems. Makers printing complex geometries with ABS, POM or polycarbonate gain reliable support removal without chemical solvents.
Build integration and material pairing
The spool weighs 0.75 kg and holds to a ± 0.1 mm diameter tolerance for consistent extrusion. It adheres strongly to ABS, POM and polycarbonate, enabling dual-extrusion prints where the model material demands high heat resistance. No heated enclosure or proprietary hardware is required beyond a printer capable of the stated nozzle and bed temperatures. Dissolving occurs in plain water, removing the need for D-Limonene or ventilation for solvent fumes.
Capacity limits and operational boundaries
The 0.75 kg spool provides enough length for multiple medium-sized prints or a single large job with dense supports. Heat resistance tops out at 100 °C, so it cannot support materials that require sustained chamber or nozzle temperatures above that threshold. The filament is not intended for structural parts or end-use components; it dissolves completely when submerged. Users needing larger spool sizes or different diameters must source separate products.
Highlights
- Dissolves quickly in plain water without harsh chemicals
- Withstands 100 °C for extended periods during printing
- Adheres strongly to ABS, POM and polycarbonate
- Extrudes at 235–250 °C with ±0.1 mm tolerance
- 75 kg spool of 2.85 mm water-soluble filament
Specifications
| Brand | Lay Filaments |
|---|
Questions about this item
How hot can the support material get before it starts to soften during a long print?
It withstands temperatures of 100 °C for extended periods, making it suitable for high-temperature technical filaments.
What bed temperature should I set for reliable adhesion when printing all day?
A heated bed at 50 °C is recommended for consistent first-layer adhesion during continuous printing.
Which model filaments does this support filament bond to without extra preparation?
It adheres well to ABS, POM and polycarbonate, so you need one of those as your primary model material.
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