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Silver rectangular processor module with gold contacts and printed label

IBM

IBM E5-2670 Xeon switch module

SKU CH-JRC9-1GQ0Q MPN E5-2670

A 12-core Xeon processor upgrade running at 2.3 GHz with 30 MB L3 cache, compatible with the IBM x3650 M5 server

  • Electrical Outlet Plug TypeProcessor Upgrade
  • 12 cores handle heavy virtualisation workloads
  • 3 GHz base clock with 3.1 GHz turbo boost
  • 30 MB L3 cache speeds data access
  • 6 GT/s QuickPath Interconnect links processors fast
  • Fits IBM x3650 M5 server sockets

Processor upgrade for IBM x3650 M5

This processor upgrade fits the IBM x3650 M5 server and delivers a dodeca-core design running at a base clock of 2.30 GHz with a turbo frequency of 3.10 GHz. It provides 12 cores and 30 MB of L3 cache built on a 22 nm process for virtualised data-centre workloads.

Replaces an earlier E5-2600 v3 series CPU

The module upgrades compatible systems from a lower-core-count or lower-frequency processor in the same socket family. The jump is worth it when workloads need the full 12 cores, the larger 30 MB L3 cache, and the 9.60 GT/s QuickPath Interconnect for multi-threaded throughput.

Suits administrators scaling virtualised clusters

It suits administrators who need the maximum core count and cache available in the LGA 2011-v3 platform for the x3650 M5. Buyers who need a different socket, a lower thermal design power than 120 W, or a processor not validated for this specific server should look elsewhere.

Highlights

  • 12 cores handle heavy virtualisation workloads
  • 3 GHz base clock with 3.1 GHz turbo boost
  • 30 MB L3 cache speeds data access
  • 6 GT/s QuickPath Interconnect links processors fast
  • Fits IBM x3650 M5 server sockets

Specifications

BrandLenovo
Electrical Outlet Plug TypeProcessor Upgrade

Questions about this item

Does the processor fit a Socket LGA 2011-v3 motherboard and the physical dimensions of 2.1" width by 1.8" depth?

Yes, the processor is built for Socket LGA 2011-v3 and measures 2.1 inches wide by 1.8 inches deep, matching that socket and form factor.

What is the correct orientation when seating the processor into the LGA 2011-v3 socket, and what step is often missed?

Align the notches on the processor with the socket keys, lower it straight down without forcing, then secure the retention lever; the step often missed is confirming the lever is fully latched before applying power.

What thermal specification should be monitored and what cooling capacity is required for this 120 W TDP processor?

The thermal specification is 84.5 °C (184.1 °F); a cooler rated for at least 120 W TDP with proper thermal paste application is required to keep the processor within that limit.

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