IBM
IBM 88Y6124 Xeon E78867L 2.13Ghz 30Mb 6.4Gt/S 32Nm 105W Switch Module
A refurbished ten-core Xeon processor running at 2.13 GHz with 30 MB cache, 6.4 GT/s QPI, 32 nm lithography and a 105 W TDP for socket LGA 1567
- Ten-core Xeon processor handles heavy multi-threaded workloads
- 30 MB smart cache reduces latency for large data sets
- 4 GT/s QPI link accelerates inter-socket communication
- 105 W TDP fits standard server power envelopes
IBM Xeon E78867L 2.13Ghz Processor
This IBM Xeon E78867L processor delivers ten cores at 2.13Ghz with 30Mb smart cache for demanding server workloads. It uses a 6.4Gt/s QPI link and fits the LGA1567 socket on compatible system boards. The 32nm design runs at a 105W thermal envelope. It suits IT teams upgrading or repairing supported enterprise platforms.
Refurbished unit supplied without accessories
The module arrives as a processor only with no heatsink, mounting hardware or thermal paste included. Buyers must source a compatible cooler and verify board firmware support before installation. This item does not meet the needs of users seeking a complete kit with cooling or those requiring a new-in-box component.
Highlights
- Ten-core Xeon processor handles heavy multi-threaded workloads
- 30 MB smart cache reduces latency for large data sets
- 4 GT/s QPI link accelerates inter-socket communication
- 105 W TDP fits standard server power envelopes
Specifications
No published specifications for this item yet.
Questions about this item
Will the LGA1567 socket need re-pasting or cooler replacement over time?
The 105 W TDP means thermal paste should be checked every few years and the heatsink fan may need replacement if noise or temperatures rise.
What thermal limit appears first when all ten cores run continuously at 2.13 GHz?
The 105 W power envelope is reached before the 6.4 GT/s QPI link saturates, so the CPU throttles to stay within its rated wattage.
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