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Refurbished Intel Xeon processor in plastic tray

IBM

IBM 46W9135 Xeon E5-2670 v2 10-core 2.5 GHz 25 MB L3 8.0 GT/s QPI 22 nm 115 W switch module

SKU CH-EH3F-D4M2P MPN 46W9135

Refurbished 10-core Xeon processor running at 2.5 GHz with 25 MB L3 cache and 8.0 GT/s QPI, 22 nm, 115 W

  • 10 cores handle parallel workloads efficiently
  • 5 GHz base clock delivers steady compute throughput
  • 25 MB L3 cache reduces memory latency
  • 0 GT/s QPI links processors at high speed

IBM Xeon E5-2670 v2 server processor

This refurbished IBM module integrates a ten-core Xeon E5-2670 v2 processor running at 2.5 GHz with 25 MB L3 cache. It fits socket FCLGA2011 platforms and communicates over an 8.0 GT/s QPI link. The 22 nm die is rated for 115 W thermal design power.

Thermals and power in typical operation

The 115 W TDP indicates substantial heat output that demands capable server-grade cooling infrastructure. Under normal workloads the chip will draw near its rated power, so airflow and heatsink capacity must match that thermal load. Acoustic levels depend entirely on the chassis fan configuration rather than the processor itself.

Highlights

  • 10 cores handle parallel workloads efficiently
  • 5 GHz base clock delivers steady compute throughput
  • 25 MB L3 cache reduces memory latency
  • 0 GT/s QPI links processors at high speed

Specifications

No published specifications for this item yet.

Questions about this item

How do I install the Xeon E5-2670 v2 into the FCLGA2011 socket without bending pins?

Align the notches on the processor with the socket keys, lower it straight down without force, then close the retention lever fully; the 22 nm die is fragile so never press the centre of the heat spreader.

What cooling capacity should I plan for the 115 W TDP of this Xeon over its service life?

Choose a server heatsink rated for at least 115 W continuous load with a high-static-pressure fan; expect to replace thermal paste every two to three years as the 22 nm silicon ages.

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