IBM
IBM 46M1085 Xeon X5550 2.66GHz processor upgrade
A refurbished quad-core Xeon processor upgrade running at 2.66 GHz with 8 MB L3 cache for Socket B LGA-1366 servers
- Electrical Outlet Plug TypeProcessor Upgrade
- Quad-core design handles parallel workloads efficiently
- 66 GHz clock speed delivers responsive processing
- 8 MB L3 cache reduces memory latency
- 95 W TDP balances performance with thermal limits
- LGA-1366 socket fits compatible server boards
IBM Xeon X5550 upgrade
This refurbished Intel Xeon DP quad-core processor runs at 2.66 GHz and fits Socket B LGA-1366 platforms. It is intended for administrators refreshing compatible IBM enterprise servers that require a 95 W TDP part with 8 MB L3 cache.
LGA-1366 socket and 95 W TDP
The processor installs directly into a Socket B LGA-1366 motherboard and draws 1.4 V DC within a 95 W thermal envelope. System builders must ensure the server cooling solution is rated for this TDP and that the chassis airflow meets the 75 °C thermal specification.
Quad-core 2.66 GHz with 6.40 GT/s interconnect
The four cores operate at 2.66 GHz and communicate over a 6.40 GT/s QuickPath Interconnect with 1 MB L2 and 8 MB L3 cache. Servers needing higher core counts, faster clock speeds or a different socket type cannot use this processor upgrade.
Highlights
- Quad-core design handles parallel workloads efficiently
- 66 GHz clock speed delivers responsive processing
- 8 MB L3 cache reduces memory latency
- 95 W TDP balances performance with thermal limits
- LGA-1366 socket fits compatible server boards
Specifications
| Brand | IBM |
|---|---|
| Electrical Outlet Plug Type | Processor Upgrade |
| Shipping weight | 0.91 kg |
| Package size | 127 × 127 × 51 mm |
Questions about this item
What does the 6.40 GT/s QuickPath Interconnect cap in practice?
The QuickPath Interconnect runs at 6.40 GT/s and links the processor to the system memory controller and other CPUs in multi-socket servers, setting the maximum bandwidth for data moving between sockets and memory.
What socket and board clearance does the LGA-1366 package need?
The processor fits a Socket B LGA-1366 socket and requires a server board with the matching ILM retention mechanism and enough clearance for a heatsink rated for 95 W TDP.
How is the processor seated in the LGA-1366 socket and what step is often missed?
Align the notches on the processor with the socket keys, lower it gently without forcing, close the load plate and engage the lever; the step often missed is cleaning old thermal compound and applying fresh paste before mounting the heatsink.
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