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HP 733619-001 Xeon processor module, green circuit board with gold contacts, silver heatsink attached, refurbished condition

HP

HP 733619-001 Xeon E5-2650 v2 2.6 GHz 20 MB 95 W switch module

SKU CH-763G-ARZTM MPN 733619-001

Refurbished HP Xeon eight-core processor running at 2.6 GHz with 20 MB cache and 95 W TDP

  • Eight-core Xeon processor handles parallel workloads
  • 6 GHz base frequency drives responsive compute performance
  • 20 MB Smart Cache reduces memory latency
  • 95 W TDP fits standard server power envelopes

HP Xeon E5-2650 v2 switch module

This HP switch module integrates an Intel Xeon 8-core E5-2650 v2 processor running at 2.6 GHz with 20 MB smart cache. It uses an FCLGA2011 socket and a 22 nm manufacturing process with a 95 W thermal design power. The unit is sold as a processor-only component for compatible server chassis.

Refurbished condition and no bundled accessories

The product arrives in refurbished condition without additional cables, software licences or mounting hardware. Buyers who require a complete kit with heatsink, fan or warranty documentation will need to source those separately. The processor-only form factor also means it is not suited for builds that expect a pre-assembled module.

Highlights

  • Eight-core Xeon processor handles parallel workloads
  • 6 GHz base frequency drives responsive compute performance
  • 20 MB Smart Cache reduces memory latency
  • 95 W TDP fits standard server power envelopes

Specifications

BrandHP
Shipping weight0.91 kg
Package size127 × 127 × 51 mm

Questions about this item

Does the Xeon E5-2650 v2 processor need thermal paste reapplied after installation?

The processor is supplied without a heatsink, so fresh thermal paste must be applied during installation and checked whenever the cooler is reseated.

What thermal limit appears first when the Xeon E5-2650 v2 runs at full load continuously?

The 95 W TDP rating defines the sustained power ceiling; the cooling solution must dissipate that heat or the processor will throttle to stay within its thermal envelope.

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