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Square grey thermal pad sheet 120 by 120 mm point 5 mm thick

GELID SOLUTIONS

GELID SOLUTIONS GP-Extreme 12W Thermal Pad 120 x 120 x 0.5 mm

SKU CH-BXRP-QYZD5

Thermal pad sized 120 by 120 by .5 mm fills gaps on uneven components like memory ICs and MOSFETs for high-conductivity heat transfer

  • Excellent heat transfer for CPUs and GPUs with 12 W/m·K conductivity
  • Soft pad fills uneven surfaces on memory ICs and MOSFETs
  • Simple installation using 120 x 120 mm pre-cut sheet
  • Thin 0.5 mm profile suits tight component clearances
  • Single pack delivers one ready-to-use pad for immediate application

120 x 120 mm thermal pad for uneven PCB components

The GELID SOLUTIONS GP-Extreme is a 0.5 mm thick thermal pad designed to bridge height differences on graphics cards, motherboards and other PCBs. Its soft construction conforms to memory ICs, MOSFETs and micro-controllers to transfer heat efficiently to a heatsink. The 120 x 120 mm sheet can be cut to fit multiple components. It is a single-use interface that compresses permanently on installation.

Check component gap and surface condition before

Measure the distance between the component top and the heatsink base to confirm a 0.5 mm pad fills the void without excessive pressure. Verify that the mating surfaces are clean and free of old compound residue. Remember that both protective films must be removed before placement, and the pad cannot be reused once compressed.

Replaces standard pads on memory and VRM zones

This pad upgrades from basic silicone sheets when lower thermal resistance is needed for high-load components. The jump is worthwhile when stock pads run too hot or leave air gaps on uneven SMD layouts. It is not suited for large, flat dies that require thin paste or for gaps thicker than the specified 0.5 mm.

Highlights

  • Excellent heat transfer for CPUs and GPUs with 12 W/m·K conductivity
  • Soft pad fills uneven surfaces on memory ICs and MOSFETs
  • Simple installation using 120 x 120 mm pre-cut sheet
  • Thin 0.5 mm profile suits tight component clearances
  • Single pack delivers one ready-to-use pad for immediate application

Specifications

No published specifications for this item yet.

Questions about this item

Is the pad pre-cut or do I need to cut it myself?

The pad measures 120 mm by 120 mm and is supplied as a single sheet; you can cut it to the exact shape required for your components.

Which thickness should I select for small gaps?

The 0.5 mm thickness is suited for tight clearances between the heatsink and low-profile chips such as memory ICs or MOSFETs.

How much heat can the 12 W rating actually move in my build?

The 12 W/m·K conductivity rating means the pad transfers heat efficiently across the interface, lowering component temperatures when compressed between the chip and cooler.

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