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Essmetuin RMA799 Soldering Flux Paste 10cc

SKU CH-KGA9-5JJZE MPN RMA799

Lead-free rosin flux paste in a 10cc push-type bottle for PCB, SMD and general electronics soldering

  • Standards/CertificationsLead Free Compliant
  • Lead-free formula meets compliance standards for safer electronics work
  • No-clean residue saves time on post-soldering cleanup tasks
  • Non-corrosive and non-conductive when dry protects sensitive components
  • High-activity rosin removes oxide layers for stronger solder joints
  • Pushing-type 10cc syringe design enables precise application with minimal waste

Lead-free flux paste for electronics repair

Essmetuin RMA799 is a lead-free soldering flux paste supplied in a 10 cc bottle. The rosin-based formula is non-corrosive and non-conductive when dry, and it requires no cleaning after use. It is designed for PCB, SMD, SMT, phone, home appliance and meter repair work.

Suitable for hobbyists

The paste suits users who need a no-clean flux for component removal, chip tin implantation and drag welding on circuit boards. It is not intended for plumbing or heavy copper-pipe brazing where a higher-solids paste is required.

10 cc pushing-type bottle for controlled dispensing

The container holds 10 cc of white flux and uses a pushing-type nozzle that delivers smoother flow with less waste during welding. This volume and dispenser style determine whether the package matches the frequency and precision of your soldering tasks.

Highlights

  • Lead-free formula meets compliance standards for safer electronics work
  • No-clean residue saves time on post-soldering cleanup tasks
  • Non-corrosive and non-conductive when dry protects sensitive components
  • High-activity rosin removes oxide layers for stronger solder joints
  • Pushing-type 10cc syringe design enables precise application with minimal waste

Specifications

Standards/CertificationsLead Free Compliant

Questions about this item

How is the 10cc flux paste dispensed for precise application?

The bottle uses a pushing-type design that delivers smoother flow and prevents wasting flux during welding.

What surface preparation is required before applying this flux to a PCB?

The high-activity rosin formulation removes the oxide layer on the welding surface so no separate cleaning step is needed beforehand.

Does the residue need to be removed after soldering SMD components?

No, the flux is non-corrosive and non-conductive when dry, leaving high surface insulation resistance without cleaning.

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