EN-Labs
EN-Labs Copper Heatsinks 7x7x5mm 2.0 W/mK Tape Pack of 8
Eight pure-copper 7×7×5 mm shims with 2.0 W/mK adhesive tape cool motherboard, GPU and DDR2/DDR3 memory chips
- Pure copper conducts heat at 401 W/mK for rapid dissipation
- 0 W/mK adhesive tape bonds instantly without extra paste
- 7×7×5 mm footprint fits tight VRAM and chipset spaces
- Eight-piece pack covers multiple components in one purchase
- Compatible with DDR2 and DDR3 modules for broad upgrades
Copper shims for chip cooling
Eight copper heatsinks measuring 7x7x5 mm arrive with pre-applied thermal adhesive tape rated at 2.0 W/mK. The shims target motherboard chipsets, graphics memory and DDR2 or DDR3 modules that run hotter than the board's stock airflow can handle. Pure copper construction gives a bulk conductivity of 401 W/mK, far above aluminium alternatives. Enthusiasts repairing consoles such as Xbox 360 or PlayStation 2 through 4 also use these for BGA packages.
Steady-state heat spreading
The adhesive tape bonds directly to the component surface, eliminating the air gaps that degrade pad performance over time. Under continuous load the copper body draws heat laterally across its 7 mm footprint before releasing it into the case airflow. Because the tape remains tacky through repeated thermal cycles, contact resistance stays low during extended gaming or compute sessions. No mechanical clips or screws are required, so vibration does not loosen the interface.
Adhesive thermal conductivity
The single figure that determines suitability is the tape's 2.0 W/mK rating; it governs how efficiently heat crosses from die to copper. If the target component generates more heat than this path can transport, temperatures will climb regardless of the copper's 401 W/mK bulk value. Buyers needing higher interface conductivity or larger footprints for voltage-regulator arrays should look elsewhere.
Highlights
- Pure copper conducts heat at 401 W/mK for rapid dissipation
- 0 W/mK adhesive tape bonds instantly without extra paste
- 7×7×5 mm footprint fits tight VRAM and chipset spaces
- Eight-piece pack covers multiple components in one purchase
- Compatible with DDR2 and DDR3 modules for broad upgrades
Specifications
No published specifications for this item yet.
Questions about this item
How much heat does the 2.0 W/mK adhesive tape actually move when these heatsinks run continuously?
The supplied tape conducts up to 2.0 W/mK, so heat flows from the chip into the copper shim at that rate; the copper itself conducts up to 401 W/mK, giving a very low resistance path once the adhesive bonds.
What must I already have to attach these 7x7x5mm copper shims to a DDR2 or DDR3 module?
Nothing extra is required — each shim comes with pre-applied thermal adhesive tape, so you simply peel and press onto clean memory chips or chipset surfaces.
Will these 0.27-inch square shims fit alongside taller legacy coolers on an older motherboard?
At only 5 mm high they sit well below most legacy heatsinks and VRM coolers, leaving clearance for existing airflow paths on DDR2 or DDR3 boards.
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