EN-Labs
EN-Labs Copper Heatsink 8x8x4mm 2.0 W/mK Pack of 8 diy cooling
Eight copper heatsinks with 2.0 W/mK adhesive tape cool motherboard, GPU, DDR2, DDR3 RAM and chipset components
- Solid copper conducts heat at 401 W/mK
- Pre-applied 2.0 W/mK thermal tape simplifies fitting
- Fits motherboard VRMs, GPU VRAM and DDR2/DDR3 modules
- 8 × 8 × 4 mm shims suit BGA chips on consoles and laptops
- Pack of eight covers multiple hotspots in one purchase
Copper heatsinks for BGA chips
Eight solid copper shims measuring 8x8x4mm arrive with pre-applied thermal adhesive tape rated at 2.0 W/mK. They target motherboard chipsets, graphics memory and legacy console processors such as Xbox 360 and PlayStation 2, 3 and 4. The copper construction delivers up to 401 W/mK bulk conductivity for small hot-spots.
Peel-and-stick mounting
Each heatsink uses a silicone-based adhesive strip that bonds directly to IC packages without screws or clips. Installation is limited to cleaning the surface, peeling the liner and pressing firmly. The tape thickness adds .16 inch to the stack height, so very tight clearances around tall components may prevent fitment.
Eight-piece capacity for multi-chip boards
The pack covers up to eight individual memory or logic chips, suitable for DDR2 and DDR3 modules or southbridge cooling. Thermal headroom is constrained by the 2.0 W/mK interface and the 4mm fin height; sustained high-wattage loads on large GPUs or multi-core CPUs will exceed the dissipation area.
Highlights
- Solid copper conducts heat at 401 W/mK
- Pre-applied 2.0 W/mK thermal tape simplifies fitting
- Fits motherboard VRMs, GPU VRAM and DDR2/DDR3 modules
- 8 × 8 × 4 mm shims suit BGA chips on consoles and laptops
- Pack of eight covers multiple hotspots in one purchase
Specifications
No published specifications for this item yet.
Questions about this item
How can I confirm the heatsinks are lowering chip temperatures after installation?
Monitor component temperatures with system software; a drop in reported values for the CPU, GPU, VRAM or chipset indicates the copper shims and 2.0 W/mK adhesive tape are transferring heat as intended.
What comes in the pack and is anything else needed for mounting?
The pack contains eight 8x8x4mm solid copper heatsinks with pre-applied 2.0 W/mK thermal adhesive tape; no extra thermal material or tools are required.
Which version should I pick for DDR2 or DDR3 memory modules?
The heatsinks are compatible with all standard SD, DDR, DDR2 and DDR3 SDRAM, so a single pack covers both memory types.
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