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Eight small copper blocks with adhesive tape, 22x8x7mm

EN-Labs

EN-Labs Copper Heatsink 22x8x7mm 2.0 W/mK Pack of 8

SKU CH-25XV-43GR2

Eight copper heatsinks measuring 22x8x7mm with 2.0 W/mK adhesive tape for motherboard, GPU and DDR2/DDR3 memory cooling

  • Solid copper shims conduct heat at 401 W/mK for faster component cooling
  • Pre-applied 2.0 W/mK thermal tape bonds instantly without extra paste
  • Eight-piece pack covers multiple motherboard, GPU and memory chips
  • Compact 22 mm footprint fits tight spaces around DDR2 and DDR3 modules
  • Compatible with Xbox 360, PlayStation 2, 3, 4 and laptop BGA chips

Eight copper shims with adhesive tape

This pack contains eight solid copper heatsinks measuring 22 by 8 by 7 millimetres. Each piece ships with pre-applied thermal adhesive tape rated at 2.0 W/mK conductivity. The shims are intended for DIY cooling of motherboard chipsets, memory modules and graphics-card components. They suit hobbyists and repair technicians who need small, ready-to-mount thermal solutions.

Adhesive tape removes the need for separate paste

The included silicone-based tape replaces thermal paste or pads, letting you press a shim directly onto a DDR2 or DDR3 memory chip, a southbridge or a GPU memory IC. Copper conducts heat at up to 401 W/mK, moving warmth away from the component faster than aluminium alternatives. Installation requires no tools and no curing time.

Shims suit low-profile chips with flat tops

The 22 by 8 by 7 millimetre footprint fits many BGA packages found on laptop boards, PlayStation 2, 3 and 4 consoles and Xbox 360 motherboards. Builders needing larger surface area, taller clearance or active airflow should choose a different cooler design.

Highlights

  • Solid copper shims conduct heat at 401 W/mK for faster component cooling
  • Pre-applied 2.0 W/mK thermal tape bonds instantly without extra paste
  • Eight-piece pack covers multiple motherboard, GPU and memory chips
  • Compact 22 mm footprint fits tight spaces around DDR2 and DDR3 modules
  • Compatible with Xbox 360, PlayStation 2, 3, 4 and laptop BGA chips

Specifications

No published specifications for this item yet.

Questions about this item

What replaces the thermal tape on each copper heatsink once it loses adhesion?

The pack includes eight shims with pre-applied 2.0 W/mK adhesive tape; when the tape no longer bonds, remove the old layer and apply a fresh strip of thermal adhesive tape of the same conductivity.

Which dimension caps the height of the heatsink in a tight laptop or console chassis?

The copper block measures 22 by 8 by 7 mm, so the 7 mm thickness is the limiting profile that must clear surrounding components.

How warm does the adhesive tape get during continuous operation on a GPU memory chip?

The tape is rated at 2.0 W/mK conductivity and the copper body conducts at 401 W/mK, so heat spreads quickly through the shim and the tape stays close to the chip temperature under sustained load.

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