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Four small copper blocks, 14 by 9 by 5 millimetres, with adhesive tape

EN-Labs

EN-Labs Copper Heatsink 14x9x5mm 2.0 W/mK Tape Pack of 4

SKU CH-8PRD-0NG8X

Four copper heatsinks measuring 14 x 9 x 5 mm with 2.0 W/mK adhesive tape for motherboard, memory and chipset cooling

  • Pure copper dissipates heat faster than aluminium, conductivity 401 W/mK
  • Pre-cut 2.0 W/mK adhesive tape makes mounting quick and secure
  • 14 x 9 x 5 mm size fits VRAM, chipset and BGA packages
  • Pack of four covers multiple components in one purchase
  • Compatible with DDR2 and DDR3 memory modules

Copper heatsink for motherboard chips

Four solid copper shims measuring 14 x 9 x 5 mm provide targeted cooling for motherboard, GPU and memory ICs. Each shim uses thermal conductivity up to 401 W/mK to draw heat away from small components. The pack suits DIY upgrades on laptops, consoles and desktop boards where space is tight.

Thermal tape and heat dissipation

Pre-applied adhesive tape rated at 2.0 W/mK bonds the heatsinks without screws or clips. The tape eliminates air gaps and stays in place during normal operation. Copper mass spreads heat laterally, lowering chip temperature without adding audible noise or extra power draw.

Compatible memory and console use

Shims work with standard SD, DDR2 and DDR3 modules as well as BGA CPU, VGA and southbridge chips. The 0.55 x 0.35 x 0.2 inch footprint fits Xbox 360, PlayStation 2, 3 and 4 motherboards. Not suited for buyers who need larger surface area or active airflow for high-wattage components.

Highlights

  • Pure copper dissipates heat faster than aluminium, conductivity 401 W/mK
  • Pre-cut 2.0 W/mK adhesive tape makes mounting quick and secure
  • 14 x 9 x 5 mm size fits VRAM, chipset and BGA packages
  • Pack of four covers multiple components in one purchase
  • Compatible with DDR2 and DDR3 memory modules

Specifications

No published specifications for this item yet.

Questions about this item

How do I install the 14x9x5mm copper heatsinks and what step is often missed?

Clean the chip surface thoroughly, peel the 2.0 W/mK thermal adhesive tape, press the heatsink firmly for several seconds, and ensure full contact — skipping the cleaning step causes poor adhesion.

Will the thermal adhesive tape on these heatsinks need replacement over time?

The 2.0 W/mK silicone-based tape is designed for long-term bonding; if a heatsink is removed, the tape cannot be reused and a fresh piece must be applied.

What thermal limit appears first when these 401 W/mK copper shims run under sustained load?

The 2.0 W/mK adhesive tape becomes the bottleneck, limiting heat transfer from the chip to the copper before the copper itself saturates.

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