EN-Labs
EN-Labs Conductive Silicone Thermal Pad 10x10x2.0mm Blue 3.2W/mK 100pcs
Pack of 100 conductive silicone thermal pads sized 10x10x2.0 mm with 3.2 W/mK conductivity for GPU, chipset and LED cooling
- FeaturesSelection of thermal silica film main objective is to reduce
- Reduces contact thermal resistance with 3.2 W/mK conductivity
- Soft 2.0 mm pads conform to uneven surfaces for full coverage
- Electrically insulating with >4 kV breakdown voltage for safe use
- Pre-cut 10 × 10 mm squares speed up installation on small chips
- 100-piece pack covers multiple GPUs, chipsets and LED modules
What it is
EN-Labs conductive silicone thermal pads measure 10x10x2.0mm and come in a pack of 100 blue pieces. They are designed to fill gaps between heat sources and heatsinks on components such as GPUs, northbridge chips, LED drivers and other ICs. The pads are soft, malleable and slightly tacky for easy placement.
Practical limits
Thermal conductivity is rated at 3.2 W/m·K with a breakdown voltage above 4kV. The material operates continuously from -40°C to 200°C and provides strong electrical insulation. Tensile strength is 180 kgf/cm². These figures define the heat-transfer capability and electrical safety margin for the intended applications.
Deciding specification
The 2.0mm thickness is the critical dimension that must match the gap between your component and its heatsink. A thinner or thicker pad will not make proper contact, reducing cooling effectiveness or causing mechanical stress. Verify the exact gap before purchasing.
Highlights
- Reduces contact thermal resistance with 3.2 W/mK conductivity
- Soft 2.0 mm pads conform to uneven surfaces for full coverage
- Electrically insulating with >4 kV breakdown voltage for safe use
- Pre-cut 10 × 10 mm squares speed up installation on small chips
- 100-piece pack covers multiple GPUs, chipsets and LED modules
Specifications
| Features | Selection of thermal silica film main objective is to reduce the contact thermal resistance between the heat source and heat sink surfaces in contact surfaces. Gap thermal silica film can be well filled with the contact surface use for Control board, the motor, electronics, auto mechanics, computer host, laptops, DVD, VCD, LID, set-top boxes ,LED IC SMD DIP and any cooling module needs to be filled and materials for electrical and electronic products. Soft,good malleability,with a little viscosity. Strong insulation and Excellent performance. Provide a mess-free installation, maximum |
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Questions about this item
How do I decide between the 10x10x2.0mm blue pads and other sizes or colours?
This listing supplies 100 pads, each 10 mm by 10 mm by 2.0 mm thick, in blue with 3.2 W/m·K conductivity; choose this pack when your gaps match those exact dimensions.
What does the 3.2 W/m·K rating mean once the pad is installed between a chip and heatsink?
It indicates the pad conducts heat at 3.2 watts per metre-kelvin, so a 2.0 mm layer across a 10 mm square moves heat efficiently while the silicone stays flexible from -40 °C to 200 °C.
Is the pad electrically conductive or insulating, and what voltage can it withstand?
The material is described as conductive silicone yet provides strong insulation with a breakdown voltage above 4 kV, so it fills gaps without shorting nearby circuitry.
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