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Ten small square copper shims, each 20 by 20 by 1.0 mm, brushed metallic finish

EN-Labs

EN-Labs 10pcs 20x20x1.0mm Copper Shim Heatsink DIY Cooling

SKU CH-B03F-BNF25

Ten copper shims measuring 20 by 20 by 1.0 millimetres fill gaps between chips and coolers on CPUs, GPUs and console processors

  • CompatibilityCPU
  • MaterialCopper
  • FeaturesThis Copper Shims thermal conductivity up to 401w / mk, and
  • Dimensions20mm x 20mm x 1.0mm
  • Thermal conductivity rated at 401 W/mK for efficient heat transfer
  • Ten shims per pack give spares for multiple chips or future repairs
  • 20 mm square by 1.0 mm thick fits tight gaps on BGA packages
  • Compatible with Xbox 360, PS2, PS3, PS4 and laptop CPU or GPU
  • Pure copper construction resists the aging that degrades thermal pads over time

DIY Copper Shims for Component Cooling

This pack contains ten copper shims measuring 20 mm by 20 mm by 1.0 mm each. They are intended for DIY thermal management on CPUs, GPUs, RAM chips and BGA components in laptops and consoles such as Xbox 360, PlayStation 2, 3 and 4.

Thermal Conductivity and Passive Operation

The copper material is rated at 401 W/mK thermal conductivity, far above ordinary copper at 20 to 30 W/mK. Being solid metal with no moving parts, they add zero noise and draw no power while spreading heat away from the die.

1.0 mm Thickness Constraint

Each shim is exactly 1.0 mm thick, so the gap between the component and the heatsink must match this dimension. Builders needing a different z-height or a compressible interface material will need another solution.

Highlights

  • Thermal conductivity rated at 401 W/mK for efficient heat transfer
  • Ten shims per pack give spares for multiple chips or future repairs
  • 20 mm square by 1.0 mm thick fits tight gaps on BGA packages
  • Compatible with Xbox 360, PS2, PS3, PS4 and laptop CPU or GPU
  • Pure copper construction resists the aging that degrades thermal pads over time

Specifications

CompatibilityCPU
MaterialCopper
FeaturesThis Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk
CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the Laptop will not start after overheating.
With this copper pad to greatly lower gpu temperatures, can be used for graphics, northbridge, CPU chips.
It can be used as heatsink solution for Xbox ,PS4 and all laptop and computer such as H
Dimensions20mm x 20mm x 1.0mm

Questions about this item

How do I install the 20x20x1.0mm copper shims on a BGA CPU or GPU, and what is the common mistake?

Clean the die and heatsink, apply a thin layer of thermal paste on both sides of the shim, then press the heatsink down evenly. The common mistake is using too much paste or stacking shims, which reduces contact pressure.

What maintenance or replacement will these copper shims need over time?

Copper does not degrade like thermal pads. Reapply thermal paste only if you remove the heatsink later; the shims themselves do not wear out.

What limit appears first during sustained load with these 401 W/m·K shims?

The 1.0 mm thickness fixes the gap size, so the bottleneck becomes the thermal paste layers and the heatsink's ability to move heat away, not the copper itself.

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