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Bolton Technical

Bolton Technical Thermal Pad 12.8 W/mK 120x20x3mm 2 in 1 accessory

SKU CH-BT25-NYVPF

High-conductivity 12.8 W/mK thermal pad, 120x20x3 mm, non-conductive and cuttable for CPU, GPU, SSD or console cooling

  • High 12.8 W/mK conductivity transfers heat rapidly
  • Electrically non-conductive pad prevents short circuits
  • Operates from -40 to 200 °C without melting
  • Soft 30–55 Shore C hardness conforms to uneven gaps
  • 120×20×3 mm sheet trims easily for custom fit

High-conductivity thermal pad for component cooling

This new Bolton Technical thermal pad uses upgraded silica-gel material rated at 12.8 W/mK thermal conductivity to move heat away from CPUs, GPUs, SSDs, VRAM modules and other hot components. The pad is electrically non-conductive with a breakdown voltage of 9.8 KV, so it can safely bridge gaps between chips and heatsinks without risk of shorting traces. It suits builders, repair technicians and anyone replacing dried-out factory pads in laptops, consoles or desktop hardware.

3 mm thickness matches common factory gap specs

The pad measures 120 mm by 20 mm by 3 mm, a size chosen to fit typical memory-module and VRM gaps found in graphics cards, laptops and game consoles. It can be cut with scissors or a knife to any smaller shape, letting you cover multiple chips from a single piece. Builders who need a thinner or thicker interface for a specific cooler clearance will not find the required dimension here.

Stable from minus 40 to 200 °C with no pump-out

Rated for continuous operation between minus 40 and 200 °C, the pad will not melt, dry out or bleed oil over time. Its Shore 00 hardness of 30 to 55 lets it conform to uneven surfaces under normal mounting pressure while resisting permanent compression set. Because it replaces thermal paste, there is no curing period and no re-application mess during future upgrades.

Highlights

  • High 12.8 W/mK conductivity transfers heat rapidly
  • Electrically non-conductive pad prevents short circuits
  • Operates from -40 to 200 °C without melting
  • Soft 30–55 Shore C hardness conforms to uneven gaps
  • 120×20×3 mm sheet trims easily for custom fit

Specifications

No published specifications for this item yet.

Questions about this item

How much heat can the 12.8 W/mK pad actually move once it is installed between a GPU and its heatsink?

The 12.8 W/mK rating means the pad conducts heat 12.8 watts per metre-kelvin, so a thin layer under a graphics card transfers heat to the cooler noticeably faster than standard 1–6 W/mK pads.

Does the pad carry any electrical current or is it purely a thermal path?

The material is non-conductive with a 9.8 kV breakdown voltage, so it insulates electrically while still passing heat between components and heatsinks.

Will the 120 by 20 by 3 mm sheet cover a laptop CPU and GPU without trimming?

The sheet measures 120 mm long, 20 mm wide and 3 mm thick; it can be cut to fit smaller dies or left whole for larger contact areas.

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