ASUS TUF GAMING B860M-PLUS + Intel Ultra 5 245K Intel motherboard combo
- LGA 1851
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ASUS
A motherboard and CPU bundle with LGA 1851 socket, DDR5 support, PCIe 5.0 slot, 2.5Gb Ethernet, USB 20Gbps port, and included Shin-Etsu thermal grease
model PRIME B860-PLUS
+CPU +Ultra 7 265K
This bundle pairs an ASUS PRIME B860-PLUS ATX motherboard with an Intel Core Ultra 7 265K processor and Shin-Etsu X-23-7868-2D thermal grease. The board uses the LGA 1851 socket and supports DDR5 memory. It is built for users assembling a new Intel Core Ultra (2nd generation) system who want the CPU, board and paste in one package.
The CPU has a 125W base power rating and features 30MB L3 cache plus 36MB L2 cache. The motherboard delivers power through 8(80A) + 1(80A) + 1(80A) + 1(80A) + 1(80A) phases on a 6-layer PCB with Digi+ VRM control. Cooling relies on VRM heatsinks with thermal pads, an M.2 heatsink, and headers for 4-pin PWM/DC fans and a water pump.
The included Shin-Etsu thermal grease offers 6.2 W/m.k conductivity and 0.07 °C*cm^2/W resistance with a 100 Pa.s viscosity; the suggested replacement cycle is 2 years. Motherboard software includes UEFI BIOS, ASUS DriverHub for driver management, and AURA SYNC with 2nd generation addressable ARGB headers for lighting control. Hardware aids feature a pre-installed I/O backplate, PCIe 5.0 SafeSlot, and Q-LED troubleshooting lights.
| Brand | ASUS |
|---|---|
| Model | PRIME B860-PLUS+Ultra 7 265K |
| CPU Socket Type | LGA 1851 |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Align the notches on the Intel Ultra 7 265K with the socket keys, lower it gently, and secure the retention lever. The step often missed is applying the included Shin-Etsu X-23-7868-2D thermal grease before mounting the cooler.
The manufacturer suggests replacing the thermal grease every 2 years, with an official lifespan of 3 to 5 years, to maintain optimal heat transfer between the CPU and cooler.
The 125W base power draw of the Intel Ultra 7 265K will test the 8+1+1+1+1 80A power stage design and VRM heatsink capacity before other board limits appear.
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