minisforum MF-SRP01 SSD Heatsink accessories barebone
- SSD Heatsink
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AMD
16-core server processor with 3.0 GHz base clock, 3.3 GHz turbo, 128 MB L3 cache, 8-channel DDR4-3200 support and 128 PCIe 4.0 lanes
The AMD EPYC 7302P is a 16-core, 32-thread CPU designed for SP3 socket server platforms. It operates at a 3.0 GHz base frequency with a 3.3 GHz maximum turbo speed. The processor provides 128 MB of L3 cache and 8 MB of L2 cache to support demanding data centre workloads.
This processor suits environments needing high core counts and 128 lanes of PCIe 4.0 connectivity within a 155 W thermal envelope. It supports eight channels of DDR4-3200 memory for bandwidth-intensive applications. Builders requiring integrated graphics, lower power consumption, or a desktop socket platform should evaluate alternative product lines.
The processor installs exclusively into motherboards equipped with the Socket SP3 interface. A compatible server-grade cooler must be sourced separately as no cooling device is included with the OEM package. Verify platform qualification lists before deployment to ensure full support.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7002 |
| Name | EPYC 7302P |
| Model | 100-000000049 |
| CPU Socket Type | Socket SP3 |
| # of Cores | 16-Core |
| # of Threads | 32 |
| Operating Frequency | 3.0 GHz |
| Max Turbo Frequency | 3.3 GHz |
| L3 Cache | 128MB |
| 64-Bit Support | Yes |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 155W |
| Cooling Device | Cooling device not included - Processor Only |
| Shipping weight | 0.64 kg |
| Package size | 203 × 127 × 76 mm |
The large 128 MB L3 cache keeps more working data on-chip, reducing latency for each of the 32 threads and improving responsiveness in dense virtual-machine deployments.
The 128 lanes of PCIe 4.0 give each x16 slot up to 32 GB/s, so multiple high-speed add-in cards can operate at full speed without sharing bandwidth.
The SP3 socket needs a compatible server heatsink rated for 155 W TDP and a motherboard with an 8-channel DDR4 VRM layout to support the 16-core processor.
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