40x40x20mm Aluminium Heat Sink 11 Fins 2.5mm Pitch
Aluminium heat sink with 11 fins at 2.5 mm pitch measures 40 x 40 x 20 mm
- TypeEngineering Development Tools
- Pure aluminium construction delivers high thermal efficiency
- 11 fins spaced at 2.5 mm pitch maximise surface area for cooling
- One-piece moulded design ensures structural integrity and clean appearance
- Compact 40 x 40 x 20 mm footprint fits tight electronic assemblies
- Lightweight aluminium keeps overall system weight low
Compact aluminium heatsink for component cooling
This 40 x 40 x 20 mm pure aluminium heatsink is designed for electronic, computer and electrical equipment that requires passive thermal management. Its lightweight one-piece construction suits engineers, hobbyists and technicians working on development boards, LED drivers or small power modules where space is limited.
Steady thermal dissipation through extended fin area
Eleven fins spaced at a 2.5 mm pitch increase the surface area for continuous heat transfer without forced airflow. The 1 mm fin thickness and 20 mm base provide a consistent thermal path during sustained loads, avoiding the rapid saturation seen in smaller stamped sinks.
Eleven fins at 2.5 mm pitch defines the cooling
The fin count and spacing are the primary specifications that determine whether this heatsink can reject enough heat for a given application. Buyers needing higher fin density, greater height or an integrated fan mount should consider alternative thermal solutions.
Highlights
- Pure aluminium construction delivers high thermal efficiency
- 11 fins spaced at 2.5 mm pitch maximise surface area for cooling
- One-piece moulded design ensures structural integrity and clean appearance
- Compact 40 x 40 x 20 mm footprint fits tight electronic assemblies
- Lightweight aluminium keeps overall system weight low
Specifications
| Type | Engineering Development Tools |
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Questions about this item
How hot does the 40x40x20mm aluminium heat sink get when running continuously?
The 11-fin design with 2.5mm spacing provides passive thermal dissipation; temperature rise depends entirely on the heat load applied to the 20mm base plate.
What mounting hardware do I need to attach this heat sink to my component?
The package includes only the aluminium module; you must supply thermal interface material and a mechanical fastening method such as screws, clips or adhesive.
Will this heat sink fit on a legacy chip package with a 40mm footprint?
The module measures 40x40mm overall, so it matches a 40mm square footprint; verify the component height clearance and mounting hole pattern before installation.
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