Ultra-Thin Lead-Free Solder Wire 0.01in 0.3mm Sn99 Ag0.3 Cu0.7 50g
Ultra-thin 0.01in lead-free solder wire with Sn99 Ag0.3 Cu0.7 alloy melts at 217°C for precise SMD work
- Compatibility/FitmentOut-Opening, Narrow Stile, Store Front Doors
- Standards/CertificationsLead Free Compliant
- Ultra-thin 0.01in diameter reaches tiny SMD pads
- Low 217 °C melting point speeds up every joint
- Sn99 Ag0.3 Cu0.7 alloy delivers reliable conductivity
- Lead-free composition meets RoHS-compliant requirements
- 5 % rosin-core flux cleans while you solder
Ultra-thin 0.01in solder wire
This lead-free solder wire measures 0.01in (0.3mm) in diameter and weighs 50g. It uses a Sn99 Ag0.3 Cu0.7 alloy with a 2.5 flux core. The low melting point of 217°C (419°F) suits precise electronics work. It is intended for hobbyists and technicians handling fine-pitch components.
Limits of rosin-core 0.3mm wire
The 0.3mm diameter restricts use to small SMD pads and fine connectors. Larger joints or through-hole pins need thicker wire for adequate fill. The 2.5 flux level cleans light oxidation but may require extra flux for heavy boards. Melting at 217°C demands a controlled iron to avoid overheating sensitive parts.
Sn99 Ag0.3 Cu0.7 alloy decides fit
This specific alloy composition determines whether the wire matches your project's metallurgical and regulatory needs. The 99% tin with 0.3% silver and 0.7% copper provides lead-free compliance and good conductivity. Buyers needing a different alloy ratio or leaded solder for lower melting temperatures should select another product.
Highlights
- Ultra-thin 0.01in diameter reaches tiny SMD pads
- Low 217 °C melting point speeds up every joint
- Sn99 Ag0.3 Cu0.7 alloy delivers reliable conductivity
- Lead-free composition meets RoHS-compliant requirements
- 5 % rosin-core flux cleans while you solder
Specifications
| Compatibility/Fitment | Out-Opening, Narrow Stile, Store Front Doors |
|---|---|
| Standards/Certifications | Lead Free Compliant |
Questions about this item
Should I pick the 0.01in diameter or a thicker wire for fine SMD pads?
The 0.01in (0.3mm) diameter is intended for tiny SMD pads; thicker wire deposits excess solder on small joints.
What does the 419°F melting point mean when I am soldering?
The alloy melts at 419°F (217°C), so any iron set above that temperature will flow the solder quickly onto the joint.
Is the Sn99 Ag0.3 Cu0.7 alloy compatible with standard lead-free rosin-core workflows?
Yes, the Sn99 Ag0.3 Cu0.7 alloy with 2.5% rosin flux is a standard lead-free composition for electronics hand soldering.
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