ENHANCE GINTBN-fce66a Copper Phone Heatsink Pad 140mm 3 Fan
A 140 mm three-fan copper heatsink pad that magnetically clamps to phones with left-mounted cameras and backs larger than 66 by 107 mm, delivering 500 per cent more heat dissipation than aluminium
- Accessory TypeCooler
- Fan Numbers3
- Fan Size140 mm Fan
- SpecificationsCopper, 0, GINTBN
- FeaturesCopper, 0
- Package Contents1
- 500% better heat dissipation with pure copper plate
- Magnetic attachment holds securely without residue
- Fits phones with backs larger than 66 mm by 107 mm
- Three 140 mm fans move air across the CPU zone
- Protects battery health and prevents thermal throttling
Copper Cooling Pad for Smartphones
The ENHANCE GINTBN-fce66a is a pure copper heatsink pad built for smartphones that throttle during gaming or streaming. Three integrated 140 mm fans draw heat away from the device's CPU zone. The pad targets mobile gamers, video creators and heavy users who need sustained performance without thermal slowdown.
Magnetic Mount and Copper Construction
A magnetic attachment grips phones with left-positioned cameras and a back surface of at least 66 mm by 107 mm (2.6 by 4.2 inches). The pure copper plate delivers a 500% increase in heat dissipation versus aluminium, spreading heat evenly across the surface. At 50 g the unit stays light, reusable and leaves no residue on the handset.
Upgrade from Passive or Aluminium Coolers
Users moving from passive stick-on pads or aluminium plates gain active airflow and far higher thermal conductivity. The jump is worth it when extended sessions cause frame-rate drops, battery ageing or uncomfortable surface temperatures. Phones without a compatible camera layout or smaller back dimensions cannot use this cooler.
Highlights
- 500% better heat dissipation with pure copper plate
- Magnetic attachment holds securely without residue
- Fits phones with backs larger than 66 mm by 107 mm
- Three 140 mm fans move air across the CPU zone
- Protects battery health and prevents thermal throttling
Specifications
| Brand | ENHANCE |
|---|---|
| Part Number | GINTBN-fce66a |
| Accessory Type | Cooler |
| Fan Numbers | 3 |
| Fan Size | 140 mm Fan |
| Specifications | Copper, 0, GINTBN |
| Features | Copper, 0 |
| Package Contents | 1 |
Questions about this item
How does the copper heatsink pad attach to the phone and what does it require?
The pad uses a magnetic backing that grips the phone firmly without adhesive; it only works on models with a flat back surface at least 66 mm by 107 mm and a left-positioned camera.
What physical space does the cooler need on the phone?
The unit measures 140 mm across and contains three fans, so the phone must provide a clear rear area of at least 2.6 by 4.2 inches for the copper plate to sit flush.
How do you set up the cooler for the first time?
Align the magnetic plate over the CPU area on the phone’s back, let it snap into place, then connect the USB power cable — the step users miss is centring the copper plate over the processor rather than the centre of the case.
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